Chiplets are redefining the future of semiconductor design.
Instead of building one massive monolithic chip, functions are split into smaller chiplets — connected at high speed inside a single package.
This approach enables higher yield, lower cost, and optimized performance.
But the real breakthrough comes with 2.5D and 3D packaging technologies:
2.5D (CoWoS, InFO, etc.): CPU, GPU, and HBM memory placed side by side on a silicon interposer.
3D (Foveros, X-Cube, etc.): Chips stacked vertically, connected by TSV (Through-Silicon Vias).
Together, these innovations push beyond the limits of traditional scaling, driving the next generation of AI chips, GPUs, and high-performance processors.
In this video, we break down chiplets, 2.5D vs 3D packaging, and why they matter for the future of computing.
